With over 5000 AOI and SPI machines in use worldwide, their 24-bit imaging technology maximizes process control for MEK electronics assembly customers as well as microelectronics companies everywhere. This cutting edge technology is designed to provide precise 3D imaging and apply it to the inspection of solder paste, semiconductor components or bare die.

 

MEK uses a variety of algorithms to detect and correct errors. One such algorithm is the IPC-A-610 class 3 defect detection and classification. This algorithm is designed to automatically detect and classify solder paste defects according to IPC specifications. It also provides a pass/fail indication for each detected defect.

 

The latest addition to MEK AOI inspection technology is the MPC-A-610. The MPC-A-610 is a machine that combines 3D imaging with the latest in digital signal processing (DSP) technology. This allows for the detection and classification of defects on both large and small components, as well as the ability to detect hidden defects.

 

The MPC-A-610 is the perfect machine for high volume production environments, where the smallest of defects can cause big problems. With its combination of 3D imaging and DSP technology, the MPC-A-610 is able to detect even the most subtle of defects, ensuring the highest quality inspection results.

 

The unique design of AOI systems provides a complete solution that can’t be matched by manual or automated optical inspection systems. MEK AOI inspection technology is the most advanced in the world, providing the highest quality inspection results for our customers.

 

With a full line of desktop AOI, inline AOI, 2D and 3D, combined with best in class THT AOI, and state-of-the-industry projector based 3D, MEK will have a solution for you. To learn more about how the MEK Marantz line of products can help your manufacturing process, contact your local sales team at Restronics.