Our sales staff at Restronics has been engaged in soldering processes for several years. We have soldering knowledge ranging from hand soldering to robotic soldering, and we can help our clients enhance their soldering performance. The foundation of all PCB assembly is soldering, yet there have been a number of advancements in recent years that we are happy to offer our clients. These range from innovative “smart” soldering equipment that help confirm that users are using the necessary soldering temperatures and that they are generating excellent solder connections to modern automated soldering technology that is becoming more cost effective as the cost of automation continues to decline. With a scarcity of experienced workers that all companies are facing, the most common request is how to streamline the soldering procedure without depending on individuals. Equipment used in selective soldering continues to be in high demand.

Because most component soldering is done in a reflow oven, soldering has become more of a rework job as component sizes continue to reduce. When it comes to reworking and repairing PCBs with small components, the real challenge is having the proper tools. Modern soldering equipment with heated SMT tweezers are required, which are capable of removing and replacing small parts as small as 0201. Our team at Restronics can explain and assist customers with these challenging applications.

Additionally, certain applications need a significant amount of thermal power. For example, some new server PCBs can be as thick as 40 layers, necessitating the use of high-capacity soldering tools. However, for some uses, hotter is not better. High power at consistent temperatures is ideal. With our showcase setup, we can demonstrate how this can be resolved without causing damage to pricey components.

Nowadays, most PCBs feature some bottom-terminated components, where the solder connections are beneath the body of the device. Operators are unable to solder or even check these solder connections. These pieces are usually LGA, QFN, or BGA devices. Soldering can be done by employing hot air or infrared heat. The personnel at Restronics is seasoned and has numerous options to respond to bottom-terminated component challenges. Many more procedures are required for BTC (bottom terminated components), like flux type and solder paste, reflow oven profile must be monitored and verified, and X-ray is the sole method to validate the procedure. The salespeople at Restronics are trained and experienced in all of these sectors.